D. Axinte; H. Huang; J. Yan; Z. Liao
International Journal of Machine Tools and Manufacture 183 (2022) 103964-103964
For many years, the machining community has dedicated significant efforts to investigate the microscopic scale level phenomena during the material removal process. On one hand much research has been carried out in relation to workpiece surface integrity after machining and the methods for its study. On the other hand, many studies have been dedicated to replicate machining conditions at microscopic scales using high resolution setups. Although these two topics seem to be little related, there is an opportunity of the machining community to take the advantage of the advanced testing/investigation setups that enable these two strands of research to be performed at very high resolution and repeatability, thus giving new pathways for research in this field. Here we are flagging up to the community the research opportunities offered by micro-mechanical testing that can be performed using in-situ scanning electron microscopes (SEM) or other high-resolution imaging instruments. As such, this review paper discusses the recent research advances in using in-situ micro-mechanical testing for: (i) understanding the phenomena occurring in the workpiece (sub) surfaces after machining operation by performing very high resolution micro-mechanical testing (e.g. compression/bending of micro-pillars/beams) within particular zones of machined superficial layers; (ii) studying the material removal mechanisms at micrometric level using common indenters or dedicated edges to understand how the workpiece materials (e.g. groups/single grains) react to cutting conditions. Finally, we comment on possible future research topics using micro-mechanical testing in-situ in high resolution imaging instruments and how this could help to advance the understanding of machining processes.