Posts

9

• Dynamic response of mixed metallic–organic glasses by micropillar compression
• Bump-shear test of a single semiconductor wire bonding showing delamination from an aluminium pad
• Progressive load scratch on an aluminium-coated semiconductor bonding pad
• Crack propagation in additive-manufactured microscale beams by 3-point bending
• Super-fast Fabrication of micropillar arrays using laser FIB combination for more statistically relevant micropillar compression tests
• Shear compression of fused silica micropillars at different strain rates

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29

• LAUNCH of the new and unique Nanoindenter for Litescope product
• New paper using Alemnis Standard Assembly (ASA) to activate pyramidal dislocations by pillar compression of Mg-alloys...
• Tensile strength and yield tests using the Alemnis Standard Assembly (ASA) system.
• See a BMG micropillar deformed at a strain rate of 520/s !!!
• The unique combined AFM-nanoindenter Litescope system
• A fine example of a cyclic tensile fatigue test

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10

• Mode dependent fracture testing
• Tensile gripper kit
• Additive-manufactured microscale springs
• Compressive behaviour of uniaxially aligned individual mineralised collagen fibres at the micro- and nanoscale
• Novel tensile testing at the microscale with the Alemnis Standard Assembly (ASA)
• Effect of high strain rates and temperature on the micromechanical properties of 3D-printed polymer structures made by two-photon lithography

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