• High-Entropy Cocrfemnni Coating Produced by Co-Electrodeposition and Subsequent Heat Treatment

• Creep Behavior of Cement Paste Microprisms at Different Relative Humidities

• Laser-Induced Forward Transfer of SU-8 Microdisks as Carriers of Metallic Microdevices

• High Strain Rate Compressive Deformation Behavior of Nickel Microparticles

• Chemical strengthening of glass powder particles

• Correlated high throughput nanoindentation mapping and microstructural characterization of wire and arc additively manufactured 2205 duplex stainless steel

• Effect of titanium and deposition parameters on microstructure and mechanical properties of W-Ti-B thin films deposited by High Power Impulse Magnetron Sputtering

• Discrete element modelling of the elastic-plastic and viscoelastic properties of a lithium-ion battery electrode layer

• Mapping the microstructure and the mechanical performance of a combinatorial Co-Cr-Cu-Fe-Ni-Zn high-entropy alloy thin film processed by magnetron sputtering technique

• Reducing the oxygen contamination in conductive (Ti, Zr) N coatings via RF-bias assisted reactive sputtering

• Basal and prismatic slip in hafnium

• 3D Printed Liquid-Filled Metal Microarchitectures

• Role of 3Y-TZP grain boundaries in glazing and layering

• Abnormal twin-twin interaction by {112¯ 2} twinning in [0001]-oriented micropillar of pure titanium at cryogenic temperature

• In-situ Transmission Kikuchi Diffraction Nano-tensile Testing